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INTERVIA™ 9000

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INTERVIA™ 9000

INTERVIA CU 8540 CARRIER / 1 LT COR PDB

Applications
  • Ideally Suited for Fan-in and Fan-out Wafer Level Packaging
  • Meeting Finer Line and Space Requirements
 
 
 

Features & benefits

  • DuPont’s INTERVIA 9000 plating chemistry can be used for both RDL and Cu pillar plating in one plating tool without changing the plating bath, making it an economical choice.
  • The function of additives in RDL plating is similar to those in Cu pillar plating.
  • Copper RDL is an interconnect technology used in both fan-in and fan-out wafer level processing.
  • Driven by mobile applications that require increased functionality at lower power, RDL requirements are tightening from 5 µm line/space to 2 µm line/space. 
  • High purity and reliability
  • It allows high-density I/Os to be redistributed for connection to the circuit board by increasing the pitch.
  • Optimum uniformity
  • Reduced manufacturing costs
  • Superior via-filling performance
  • This calls for plating chemistries that can achieve high reliability with low-within-die uniformity.
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    Product Details

    Fabric/material

    AP COPPER

    Design

    INTERVIA™ 9000

    Seam

    INTERVIA™ 9000

    Packaging

    AP COPPER

    Hazard

    Coated Material

    AP COPPER

    Features

    AP COPPER
     
     
     
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