MICROFILL™ THF-100 Electrolytic Copper

MICROFILL™ THF-100 Bath is designed to provide through hole fill of inner core layers for IC-Substrate PCB. Compared to conventional via fill processes, this new technology improves reliability, and both electrical and thermal conductivity. Customers benefit from reduced process cost and a shortened new manufacturing process.

    Advantages:
  • DC Process
  • Excellent through hole fill performance
  • CVS can be applied for bath control
  • Elimination of conductive paste, ink and solvents
  • Highly conductive, improved thermal properties
  • Excellent copper to copper adhesion, providing improved reliability
  • Reduced CTE mismatch within filled via structure
  • Reduced costs/Increased productivity

On-Demand webinar, 
click here for more information.