Microfill™ THF-100 Bath is designed to provide through hole fill of inner core layers for IC-Substrate PCB. Compared to conventional via fill processes, this new technology improves reliability, and both electrical and thermal conductivity. Customers benefit from reduced process cost and a shortened new manufacturing process.

Advantages:

• DC Process
• Excellent through hole fill performance
• CVS can be applied for bath control
• Elimination of conductive paste, ink and solvents
• Highly conductive, improved thermal properties
• Excellent copper to copper adhesion, providing improved reliability
• Reduced CTE mismatch within filled via structure
• Reduced costs/Increased productivity

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Behind the Scenes of DuPont’s Finalists for the 2015 R&D 100 Awards: Part 1 | Microfill™ THF Electrolytic Copper