Microfill™ THF-100 Electrolytic Copper Bath

Microfill™ THF-100 Bath is designed to provide through hole fill of inner core layers for IC-Substrate PCB. Compared to conventional via fill processes, this new technology improves reliability, and both electrical and thermal conductivity. Customers benefit from reduced process cost and a shortened new manufacturing process.

Advantages:

  • DC Process
  • Excellent through hole fill performance
  • CVS can be applied for bath control
  • Elimination of conductive paste, ink and solvents
  • Highly conductive, improved thermal properties
  • Excellent copper to copper adhesion, providing improved reliability
  • Reduced CTE mismatch within filled via structure
  • Reduced costs/Increased productivity

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Microfill™ LVF Electrolytic Copper

Behind the Scenes of DuPont’s Finalists for the 2015 R&D 100 Awards: Part 1 | Microfill™ THF Electrolytic Copper

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