PALLAMERSE™ SMT 2000 Electroless Palladium

PALLAMERSE™ Electroless Palladium is an electroless palladium process specifically formulated for use in combination with DURAPOSIT™ electroless nickel baths and AUROLECTROLESS™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PWBs. The PALLAMERSE™ is an autocatalytic palladium process capable of depositing palladium coatings onto electroless nickel to meet subsequent SMT assembly requirements.

    Key Benefits:
  • High bath stability
  • Uniform Deposits
  • Bondable with gold, copper and aluminum wire
  • Excellent solderability
  • Cost-effective alternative to electrolytic nickel-gold
  • RoHS compliant