This film possesses excellent bonding characteristics to itself and to other fluoropolymer-containing materials, while providing low adhesion to metal conductors.
DuPont™ Oasis® 200TRT515 is a heat sealable composite film that is made using DuPont high tensile strength polyimide film and DuPont fluoropolymer designed to meet the light weight wire requirements of AS22759/80-92. 200TRT515 film has a unique balance of excellent electrical, thermal durability, and chemical resistance properties, including improved hydrolytic stability, that make it ideal for the next generation of aerospace wire designs.
200TRT515 film possesses excellent bonding characteristics to itself and to other fluoropolymer-containing materials, while providing low adhesion to metal conductors. These unique bonding characteristics should provide a wide operating window for producing modern composite wire insulations.
Processing of this material can be done on most wire taping standard polyimide films.
Table 1. Typical Properties of Oasis® 200TRT515 Film
PROPERTY |
UNITS |
TYPICAL VALUE |
TEST METHOD |
---|---|---|---|
Thickness |
mil |
2.00 |
ASTM D374 |
Density |
g/cc |
1.81 |
ASTM D1505 |
Tensile Strength |
kpsi |
30 |
ASTM D882 |
Tensile Modulus |
kpsi |
480 |
ASTM D882 |
Elongation |
% |
70 |
ASTM D882 |
Moisture Content |
% |
<1.0 |
DuPont Test Method |
Heat Seal Strength at 350°C |
g/cm |
500 |
DuPont Test Method |
Seal Initiation Temperature |
°C |
280 |
DuPont Test Method |
Dielectric Strength |
V/mil |
4600 |
ASTM D149 |
Dissipation Factor at 1 kHz |
- |
0.010 |
ASTM D150 |
Dielectric Contant at 1 kHz |
- |
2.85 |
ASTM D150 |
Volume Resistivity |
ohm-cm |
1016 |
ASTM D257 |
Yield |
ft2/lb |
53.2 |
DuPont Test Method |
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