Nikaflex® Epoxy-based Adhesive Systems
Nikaflex® laminates consist of a family of epoxy-based adhesive systems used in combination with copper and DuPont™Kapton® polyimide film.
These flexible circuit materials are ideal for use in cost sensitive flexible printed wiring board applications not requiring high-performance needs.
Nikaflex® Epoxy-based Clads
Nikaflex® F-20V - 20V features excellent flexing performance and has an elevated glass transition temperature
Nikaflex® F-30V - is a general-purpose laminate widely used in the flex circuit industry
Nikaflex® F-50V - provides superior ion migration performance
Nikaflex® F-60V - 60V offers an even higher Tg while still maintaining a high level of flexibility
Nikkaflex® Coverlay Films
There are three different coverlay films available:
Nikaflex® CISV - is a general-purpose adhesive typically used with F-30V copper clad laminate
Nikaflex® CISA - paired with F-50V copper clad laminate, provides superior ion migration performance
Nikaflex® CISD - is a high temperature adhesive system and is typically used with F-20 or F-60V copper clad laminate
Nikaflex® Epoxy-based Adhesive Films
Also available are three complementary bonding films:
Nikaflex® SAFW - for general-purpose applications
Nikaflex® SAFV - for multi-layer flexes
Nikaflex® SAFD - for high temperature applications
Nikaflex® is a registered trademark of, and used with permission of, Nikkan Industries Co., Ltd.
Product Data Sheets (8)
- Nikaflex® F-20V & F-60V Copper Clad Laminates and CISD Flexible Coverlay (PDF)
- Nikaflex® F-30V Single-sided and Double-sided Copper Clad Laminates (PDF)
- Nikaflex® F-50V Single-sided and Double-sided Copper Clad Laminates (PDF)
- Nikaflex® CISA Polyimide Base Coverlay (PDF)