Using Flex in High-Speed Applications
Copper clad circuits in the printed circuit industry have evolved into four different classes, each having different sets of standards. For instance, IPC has separate sets of standards for rigid, flexible, high speed and high frequency, and HDI. Further, there are separate standards within these families for design, acceptance, and base materials. These standards provide logical organization to the design, process, and material considerations of each class of circuit. In many applications, however, designs may utilize all four classes of boards in a single assembly. This presents significant challenges for the designers, fabricators, and materials suppliers because choices made using design rules from one type of board may significantly limit utilization of another type of board on the same assembly.
This article will focus on flexible circuit technology and specifically, on the material properties that account for the broader use of flexible circuits in high frequency and high-speed applications.
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