Pyralux® Copper Clad Laminates

Pyralux® Single-Sided & Double-Sided Copper Clad Laminates

DuPont™ Pyralux® flexible laminates are available in a broad range of copper clad constructions using a wide variety of base dielectrics. These laminates are available in either adhesive based or all polyimide form.

Adhesive based clads, also known as 3-layer, are made using DuPont™ Kapton® and are available in sheet form with either Pyralux® FR or LF acrylic adhesive. Also available, under the Nikaflex® brand name, is an epoxy adhesive based 3-layer clad in roll form.

All polyimide clads, also known as 2-layer, are available either as double-sided using a lamination based manufacturing process or single sided utilizing cast technology.

All copper-clad laminates are available with rolled, annealed copper or electro-deposited copper. In addition, both types are available with double-treated copper (nodules of electro-deposited copper on both sides of the copper foil). Double-treated copper, if used, eliminates surface preparation steps prior to resist or coverlay lamination. 

Pyralux® laminated composites are typically used to produce high reliability, high density circuitry of flexible, rigid-flex, and all-flexible multilayer constructions. 

Pyralux® Adhesive Based Clads

Pyralux® FR - Pyralux® FR acrylic based laminates are made with DuPont™ Kapton® polyimide film and are available in sheet form as single or double sided clads in a wide variety of thicknesses. 

Pyralux® LF - DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.

Pyralux® All Polyimide Clads

Pyralux® AP - DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.

Pyralux® AC - DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.

Pyralux® APR - DuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing are required. 

Pyralux® HT - DuPont™  Pyralux® HT is an all polyimide flexible laminate system with the highest service temperature available today, that includes a double-sided copper-clad laminate and a unique all polyimide coverfilm or bonding material.