Technical Bulletins
Technical Bulletins are provided, where possible, to assist you with additional product information on proper use, handling, and solving technical issues and challenges. Some issues require that we gather additional information prior to responding. As such, bulletins noted with an asterisk (*) are not available on-line. To obtain information on these, please click on the link and contact your local DuPont representative.
Riston® Technical Bulletins:
- TB-9301 Filtering Preplate Clean Baths*
- TB-9303 Improved Development Quality Through Solution Filtration*
- TB-9304 Determining Development Breakpoint Using Water Soluble Pens*
- TB-9408 Reducing Defects at Exposure Through Localized Particle Control*
- TB-9412 Excess Copper*
- TB-9415 Common Chemicals Used in the PWB Industry
- TB-9519 Ragged Pattern Plated Circuit Lines*
- TB-9521 Review of "Direct Plate" Processes and Assessment of the Impact on Primary Imaging of Printed Wiring Boards*
- TB-9522 Recommended Developer & Stripper Equipment Cleaners for Riston Photoresists*
- TB-9523 Recommended Touch-up Pens for Riston Photoresists*
- TB-9526 Riston® and Stouffer Density Tablets
- TB-9527 Preventing Resist Related Through-hole Voids*
- TB-9629 Prelamination Cleaning for Chemical Milling*
- TB-9739 Using Crowned Rolls to Compensate for Roll Binding*
- TB-9840 Elimination of Acid etcher Organic Residues*
- TB-9841 Handling & Safety Considerations for the Riston® Enhancement Bake Process
- TB-9842 Hard Water Rinsing in Development*
- TB-9843 Cause of Lamination Wrinkles*
- TB-9944 Handling Procedures for DuPont Photopolymer Films
- TB-9945 Optimizing Dry Film Photoresist Lamination for Fine Line Innerlayers*
- TB-9947 Determining Weight Percent Carbonate in Developer Solution
- TB-9948 Preparation of Electroless Copper for Resists Lamination to an Unscrubbed Surface*
- TB-9949 Solving Stripping Problems in Pattern Plating*
- TB-0172 Surface Preparation and Dry Film Performance*
- TB-0173 Avoiding Repetitive Lamination Defects*
- TB-0174 Handling Procedures for Riston®Bulk Packaging
Phototools Technical Bulletins:
- TB-0065 Product Safety and Health Information for Diazo Phototooling Films
- TB-0066 Product Safety and Health Information for Silver Halide Phototooling Films
- TB-0170 Recommended Practices for Handling and Storing Photographic Films
Vacrel® Technical Bulletins:
- TB-0050 Copper Staining Under VACREL®*
- TB-0051 National Security Agency (NSA) Testing of DuPont Solder Masks for Hydrolytic Stability
- TB-0052 Epoxy Chemistry in Solder Mask Formulations*
- TB-0053 Water Cleaning OA Fluxes After Wave Soldering
- TB-0054 Handling and Safety Considerations for the VACREL® Solder Mask Curing Process
- TB-0055 Wave Solder Hole Filling*
- TB-0056 Temporary Mask Compatibility with DuPont VACREL® 8100 Series Solder Mask
- TB-0057 The Use of VACREL® Dry Film Solder Mask in Surface Mounting Applications*
- TB-0058 Solder Mask Over Bare Copper*
- TB-0059 VACREL® 8140 Outgassing in a Vacuum
- TB-0060 VACREL® 8100 Series End Use Properties and Test Data
- TB-0061 PCB Ion Washing Reduces Ionics on Pre-Assembled and Post-Assembled Printed Wiring Boards*
- TB-0062 DuPont Solder Mask Performance with Assembly Cleaners
- TB-0063 Conformal Coatings Compatible with DuPont VACREL® Solder Mask
- TB-0064 Thermal Curing Considerations*
General Technical Bulletins:
- TB-0168 Storage Conditions for Riston® and VACREL®
- TB-0169 Safe Lighting for Riston® Photopolymer Dry Film Resists