Ultra Fast Photospeed Direct Imaging Resist
DuPont began formulating specialized photoresists for Laser Direct Imaging (LDI) over 20 years ago, and continues to lead the industry with its Riston® LaserSeries films.
Ultra fast photospeed, high performance, and compatibility with conventional printed wiring board (PWB) processes are critical to help PWB fabricators optimize their LDI equipment investments.
Riston® Laser Series Dry Film Photoresists Include:
- For specialty outerlayer plating applications on 355nm direct imaging equipment
- Exposure productivity and plating latitude enhance throughput and yields
- High productivity film is fully aqueous
- Possesses ultra-fast photospeed
- Compatible with both acid and alkaline etching
- Customized for tent and etch processes with 355nm direct imaging equipment
- Excellent tenting strength, resolution and adhesion
- Fast stripping that contributes to higher yield and productivity
- Designed to provide superior performance on LDI imaged outerlayer boards
- Broad range of plating solutions (copper, tin, solder, nickel and gold)
- Available in thicknesses ranging from 40 microns to 100 microns
- Gives fabricator one film to meet all of their imaging needs
Riston® LDI 8000
- Developed for 405 nm LDI equipment
- Fast photospeed (13mJ/cm2~)
- Excellent resolution with wide exposure latitude
- Good conformity
- Vivid printout image
- Strong tenting with excellent hold time stability
Product Data Sheets (8)
- Riston® 200 Series for Acid & Alkaline Etch (PDF)
- Riston® LaserSeries LDI300 High-Speed Direct Imaging Resist (PDF)
- Riston® LaserSeries LDI500 High-Speed Direct Imaging Resist (PDF)
- Riston® LaserSeries LDI7000 Laser Direct Imaging Resist (PDF)
- Riston® LaserSeries LDI7100 Laser Direct Imaging Resist (PDF)
- Riston® LaserSeries LDI7200 Laser Direct Imaging Resist (PDF)
- Riston® LaserSeries LDI7300 Laser Direct Imaging Resist (PDF)
- Riston® LaserSeries LDI8000 Laser Direct Imaging Resist (PDF)
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