Microbump Creation System for Advanced Packaging Applications
The focus of this paper is twofold. The first part will focus on the process development and characterization of the 40 micron thick DuPont MXAdvance* 140 dry film candidate with 2:1 aspect resolution ratio on a 40 micron pitch application with 30 – 40 micron high pillars/micro-bumps. The second part will review the results of the DuPont EKC162™ remover tests and its impact on copper and lead free, and or solder electro-deposition processes. Together, the combination of a high resolution dry film and effective remover chemistry that strips the photoresist cleanly from the wafers offers customers a viable process for producing micro-bump technologies.