Dow’s Organic bottom antireflectant coatings (BARCs) are cross-linkable polymers that are spin cast on wafers and serve the purpose of controlling the back-reflection of light from the wafer surface into the resist material above it. Dow’s AR™ Fast Etch Organic BARCS are based on polymers that contain a chromophore to reduce substrate reflectivity and include oxygen-rich monomers that etch quickly during the pattern transfer step. The fast etch properties of these products and the easy removal without significant loss of the resist film thickness are key to making advanced integrated circuits.
Substantially faster etch rates than the organic photoresist
Easily removed without significant loss of the resist film thickness
Figure 1. Dow AR™ Fast Etch Organic BARCs solve the issues of light reflection that impact negatively on photoresist resolution. Use of Fast Etch Organic BARC diminishes reflectance from the substrate.
Figure 2. The image on the left is an example of improved line width control when using Dow’s AR™ Fast Etch Organic BARCs. The image on the right shows a pinched line, a common defect when no organic BARC is used.
Figure 3. This is an illustration of a typical patterning process flow. Dow’s AR™ Fast Etch Organic BARCs play a critical role in reflection control and etch pattern transfer.