Suba™ CMP Pads

Suba™ CMP Pads

DuPont's Suba™ pads are chemical mechanical planarization (CMP) pads for stock, intermediate and final polish. They offer significant advantages in achieving consistent, reproducible results in polishing semiconductor wafers, glass and ceramics. The Suba™ family of polishing pad products is the industry standard for silicon stock removal polishing. They may also be used as a sub-pad.

Applications
  • Polishing fragile crystals or other delicate surfaces
  • Polishing glass, quartz, ceramics, special metals and plastic
  • Silicon wafer polishing
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
Technical Resources
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    Safety Data Sheets(All Languages)
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      Other CMP Applications

      Our CMP pads cover a wide range of applications and technology nodes. To further explore Dupont CMP pads, see our overview of the product families by application

       
       
       
       
       
       
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