CMP Pads


CMP Pads

DuPont's Broad Portfolio of Polishing Pads

DuPont is a global leader in polishing pads, slurries and application expertise for chemical mechanical planarization (CMP) serving the semiconductor chip manufacturing industry and other advanced substrate polishing applications. With decades of experience, DuPont offers a full range of polishing pads and slurries designed to meet the distinct performance needs of each CMP application and node. Every product incorporates specific design goals and fundamental science to achieve the required performance. Our advanced R&D capabilities, including statistical process control, automation, and product characterization and analysis, have led to significant advancements in materials innovation.

With application facilities close to our customers, we’ve been able to develop key collaborations with our customers to accelerate product and process development, including CMP processes below 14 nm and planarization materials for 3D-IC technologies. Our strategic alliances and collaborations bring new CMP technologies to our customers at an accelerated pace while making available materials that are best-suited to each customer’s specific process requirements.

  • Our CMP pads cover a wide range of applications and technology nodes. For help understanding which technologies are well-suited for different CMP applications, please refer to the following chart.

    Copper Bulk Polishing

    Ikonic™ 3040M, 4121H, 4250H

    Visionpad™ 6000, 7480, 9280


    Copper Barrier Polishing

    Ikonic™ 2010H, 2020H, 2040H, 2060H

    Visionpad™ 3100, 3500

    Optivision™ PRO 9500

    Tungsten Polishing

    Ikonic™ 4250H, 4121H, 4141H

    Visionpad™ 5000


    STI /Ceria Polishing Applications

    Ikonic™ 4121H, 4140H, 4250H

    Visionpad™ 5000, 6000


    Oxide Polishing

    Visionpad™ 5000, 6000, 7480


    Buff Polishing

    Ikonic™ 2010H, 2020H, 2040H, 2060H

    Optivision™ 4540, 4548

    Optivision™ PRO 9500

    Politex™, Politex™ AT



Materials for CMP

  • CMP Pads

    Broad portfolio of CMP pads to meet the needs of any application.

    The IC1000™ series of pads for chemical mechanical planarization (CMP) is the industry standard.

    A breakthrough pad platform designed for advanced nodes

    The Optivision™ pad series for chemical mechanical planarization (CMP) is DuPont’s second generation soft pad that improves on the performance of Politex™ pads and is designed for improvements in cost of ownership.

    The Optivision™ Pro series of polishing pads for chemical mechanical planarization (CMP) is DuPont’s third-generation soft pad manufactured on a new platform that facilitates advanced polishing and is designed for improvements in cost of ownership.

    The Politex™ pad series for chemical mechanical planarization (CMP) is used for copper barrier, buffing and cleaning applications. Politex™ pads are the industry-standard soft pad.

    DuPont's Suba™ pads are chemical mechanical planarization (CMP) pads for stock, intermediate and final polish.

  • CMP Slurries

    A range of offerings for chemical mechanical planarization (CMP) including Novaplane™, Optiplane™, Acuplane™ and Klebosol® slurries.



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