Tyvek® for Electronics Active Packaging


A Critical Part of Protection for Electronic Devices and Components

Even in small amounts, moisture can damage electronics. DuPont™ Tyvek® in Active Packaging applications for electronics is engineered to allow rapid absorption of moisture vapor, as well as other hazards like oxygen and corrosive volatiles. Tyvek® helps provide the protection that maintains optimal device performance and reliability.

  • No fiber contamination: Tyvek® is non-linting, eliminating the risk of fiber contamination.
  • Non-dusting: Tyvek® has excellent particle barrier properties.
  • Stronger seal: Tyvek® with heat-seal coatings ensures a stronger, more durable and more attractive seam.
  • Breathable: The unique properties of Tyvek® allow vapor to enter while preventing liquid from escaping.
  • Mildew and rot proof: Tyvek® is a chemically inert material that won't rot or mildew.
  • Printable: Tyvek® can be printed using standard commercial printing equipment and suitable inks.

A range of basis weights. Customizable sizes. Fin and lap seals. Coated for heat seal applications or uncoated for impulse and ultrasonic welding. Whatever the needs are, DuPont™ Tyvek® experts are ready to help meet them.