EKC R&D Capabilities

  • Modern Facilities in USA, Japan and Taiwan 

    • fundamental and applications research
    • current technology equipment
    • work closely with EKC Application Engineer staff

  • Leading University Cooperative Research
  • R & D Partnerships with Leading Semiconductor Manufacturers

Analytical Techniques Include:

  • AFM/STM - Burleigh & Veeco
  • Surface features & roughness  
  • Metal or oxide thickness
  • Contact angle - First Ten Angstroms - Cross
  • Surface wetting/hydrophobicity
  • Ellipsometer - Gaertner & J. A. Wollam
  • Film thickness determination
  • Field emission SEM & EDAX - Hitachi S-5500
  • Surface examination and chemical analysis
  • Four-point probe - Four Dimensions 280 & Four Dimensions 333A
  • Thickness of metal layers on wafers
  • FTIR spectrometer - Bio-Rad & Perkin Elmer
  • Organics/inorganics analysis
  • Gas chromatograph - HP
  • Organics analysis
  • GC-mass spectrometer - HP
  • Compound identification
  • HPLC - HP/Agilent
  • Organics/inorganics analysis
  • Impedance analyzer - Solartron
  • Corrosion, passivation analysis
  • Refractometer - Abbe
  • Spin coater - Denton & Emitech
  • Surface coating for wafers
  • Surface profiler
  • Surface roughness
  • Thermogravimetric analyzer - Shimadzu TGA-51
  • Organic volatiles by weight loss
  • UV/Vis spectrophotometer - HP
  • Organic solution analysis
  • Zeta potential
  • Surface charge determination
  • XRF - PW2800 and MiniPal4 from Panalytical
  • TXRF - Rigaku
  • ION Chromatography - Dionex
  • Laser scriber - K-jet Laser Tek
  • Bench Top Polisher - CETR