CMP Pads

Optivision™ Pro CMP Polishing Pads

Optivision™ Pro CMP Polishing Pads

The Optivision™ PRO series of polishing pads for chemical mechanical planarization (CMP) is DuPont’s third generation soft pad manufactured on a new platform that facilitates advanced polishing and is designed for improvements in cost of ownership.

  • Benefits:

    • Highest TEOS removal rate and lowest defectivity offering from DuPont
    • Available with windows and multiple grooving options
    • Improved lifetime compared to Politex™ and Optivision™ pads

    Applications:

    • Copper barrier, Buff, Polysilicon