The reliability of DuPont™ Kalrez® seals means less downtime, longer maintenance intervals, and lower operating costs while maximizing wafer production.
O-ring reliability is critical for the piping and pumps that support the sub-fab processes of semiconductor chip manufacturing. Kalrez® solutions are specifically designed to meet the demands of seals for heat-traced lines in sub-fab foreline and exhaust systems. It also provides outstanding thermal stability (up to 300°C), improved sealing functionality, and excellent chemical resistance/resistance to plasma radicals.
The ability of Kalrez® O-rings to perform in harsh sub-fab environments benefits chip manufacturers by safely feeding and exhausting toxic gasses as well as extending mean-time-between-repair (MTBR).