DuPont Solamet® for Passivated Emitter Rear Cells (PERC)


  • Improved Voc from minimized surface recombination without trade-off in fill factor (FF) at lower firing temperatures
  • Improved open circuit voltage (Voc) from minimized paste induced rear passivation damage
  • Better short circuit current (Jsc) from improved fine line capability
  • Good back surface field (BSF) formation on localized contact
  • Provides proven module reliability
  • Demonstrated strong adhesion to passivation layers
  • Minimized Kirkendall voids
  • Reliable module performance after climate chamber test
  • Non fire-through capability
  • High adhesion with low consumption
  • Co-fireable with Solamet® front side silver and back side aluminum
  • Very good local BSF formation with minimum voiding
  • High adhesion on passivation layer (SiO2/SiNx, Al2O3/SiNx stacks) with no dielectric damage
  • Fast drying and firing
  • Low electrical resistivity after firing
  • Cadmium free*