Innovate for Good
Delivering solutions for global challenges
Energy Efficient Computing in the Palm of Your Hand
Computing power in electronic devices continues to increase at phenomenal rates, and the complexity in producing reliable high performance computing materials requires constant innovation. DuPont’s innovations in semiconductor fabrication and packaging materials are fundamental to delivering the advanced node and advanced architectures of today’s cutting-edge logic and memory devices, such as modern smartphones.
High-performance devices contain more and more transistors stacked at increasing density. Packing in more transistors should mean more energy consumption per device. DuPont innovations have an important role in enabling devices to be up to 4x more power efficient than those introduced just five years ago.
Moore’s Law is the observation from Gordon E. Moore made in 1965 that the number of transistors in an integrated circuit doubles about every two years. Increases in the number of transistors per chip increases computing speed. Today, the semiconductor industry continues to find ways to advance in the spirit of Moore’s Law through strategies including shrinking, stacking and heterogenous integration. The newest high-performance computing devices contain over 50 billion transistors in a single chip!
High-performance computing is used today to enable everything from ultra-fast smartphones to artificial intelligence for weather forecasting. Increases in speed and power are making these applications possible. At the same time, the energy consumption required to produce this computing power has significantly decreased by about 4x! The combination of miniaturization, transistor stacking and heterogenous integration strategies by chip manufacturers bring more computing power while consuming less power per bit.
DuPont’s polishing pads and slurries help provide smooth and uniform wafers across the fabrication process; while photoresists, advanced cleaning chemistries, etchants and metallization products deliver fine line features; and packaging and assembly materials protect and enable heat flow out of chipsets. We work closely with our customers to deliver materials to meet the needs of different technology nodes, processes and packaging schemes.
Learn more about DuPont’s offerings for the semiconductor industry:
https://www.dupont.com/electronic-materials/semiconductor-fabrication-and-packaging-materials.html
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