Innovate for Good
Delivering on global challenges
High Signal Fidelity at High Frequencies
High frequency connectivity is a critical enabler of SDGs related to work, quality education, public safety and health and well-being.
Preserving signal fidelity at higher frequencies (5G service and beyond) requires new technology and innovative materials to tackle unique challenges related to telecommunications infrastructure and devices, such as mobile phones. For example, today’s mobile phones have multiple antennas to send and receive signals across many frequencies to support 3G, 4G and 5G service. 5G antennas must not only minimize signal losses but must fit into a compact footprint within the phone, where space for the display and battery are prioritized. Furthermore, technology that manages electromagnetic interference (EMI) is needed to prevent cross-talk to antenna materials.
In today’s high-performance electronic devices, data consumption continues to stretch the limits across a variety of end-market segments, including healthcare, telecommunications, military, industrial and aerospace. High-speed, high frequency signal transfer across the telecommunications networks creates many circumstances in which signal fidelity can be compromised, resulting in unreliable service for customers who depend upon their devices. Such challenges need to be met in a way that maintains device affordability (e.g. enabling high manufacturing yields) and enables designers to deliver the mobile phone features consumers want.
DuPont’s Pyralux® polyimide laminate solutions tackle the dual challenges of delivering high signal fidelity at high frequencies (over 6GHz) while significantly improving manufacturing yields, reducing industrial waste, transitioning to lower footprint materials and lower manufacturing costs.
Continuous innovation by our engineers and scientists also includes transitioning to recycled copper foil for a lower footprint. These actions with our DuPont Pyralux® product line deliver superior performance combined with improved sustainability.
DuPont has long been a market leader in laminates for flexible and rigid-flex PCBs. Our extensive family of Pyralux®, Interra® and Temprion® branded products expands possibilities for flexible laminates, embedded passives and thermal performance in demanding applications such as 5G networks, electric vehicles, and consumer electronics.
To learn more about this and other innovations in our business: https://www.dupont.com/electronic-materials/laminates.html
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