Key challenges: for the semi-conductor industry, particles, scratching, ion contamination and static will cause damage in delicate electronic parts. Vacuum manipulation could also be a challenge. Wafer packaging solution provider, integrated circuit (IC) design company, have been looking for improved packaging solutions to address these common issues.
Values that Tyvek® can provide:
Tyvek® 1025D, 1056D
Tyvek® for Industrial Packaging
DuPont™ Tyvek® combines the best physical properties of paper, ﬁlm, and fabric to offer unique advantages for a wide variety of demanding packaging applications.Made of 100% high density polyethylene ﬁbers, Tyvek® brand materials are manufactured in a unique ﬂash-spinning process without the use of binders—providing a durably rugged sheet structure that outperforms many conventional packaging materials, in many environmental conditions.