Wafer Spacer


Tyvek® for Interleaf/Wafer Spacer offers excellent protection for delicate electronic devices.

Key challenges: for the semi-conductor industry, particles, scratching, ion contamination and static will cause damage in delicate electronic parts. Vacuum manipulation could also be a challenge. Wafer packaging solution provider, integrated circuit (IC) design company, have been looking for improved packaging solutions to address these common issues.

Values that Tyvek® can provide:

  • Tear resistance to help secure the protection between wafers
  • Low linting and smooth surface can help avoid particles and scratching
  • Anti-static treatment can help minimize ESD (Electrostatic Discharge)

Tyvek® Styles:
Tyvek® 1025D, 1056D

DuPont Product & Service

Tyvek® for Industrial Packaging

DuPont™ Tyvek® combines the best physical properties of paper, film, and fabric to offer unique advantages for a wide variety of demanding packaging applications.Made of high density polyethylene fibers, Tyvek® brand materials are manufactured in a unique flash-spinning process without the use of binders—providing a durably rugged sheet structure that outperforms many conventional packaging materials, in many environmental conditions.

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