Back-end

 
 
 

DuPont solutions for precision testing and packaging without damaging delicate wafers

DuPont™ Vespel® parts for back-end processes won’t damage wafers like metal or ceramic. In fact, Vespel® prevents scratches and allows for greater precision. 

 
 
 
 
 
 

Wafer handling, packaging, and testing are critical in delivering high-quality chips. At each step, there’s a risk of damage. Vespel® is ideal for semiconductor packaging, testing, and pick-up collets because it provides:

• Dimensional stability
• Low wear
• Low CTE (coefficient of thermal expansion)
• Low moisture absorption

Plus, Vespel’s® balanced mechanical properties allow for dimensional stability and precision machinability as a housing material of test sockets. 

 
 
 
 
 
 
 
 
 

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