Back-end
DuPont solutions for precision testing and packaging without damaging delicate wafers
DuPont™ Vespel® parts for back-end processes won’t damage wafers like metal or ceramic. In fact, Vespel® prevents scratches and allows for greater precision.
Wafer handling, packaging, and testing are critical in delivering high-quality chips. At each step, there’s a risk of damage. Vespel® is ideal for semiconductor packaging, testing, and pick-up collets because it provides:
• Dimensional stability
• Low wear
• Low CTE (coefficient of thermal expansion)
• Low moisture absorption
Plus, Vespel’s® balanced mechanical properties allow for dimensional stability and precision machinability as a housing material of test sockets.
