DuPont has long been a market leader in laminates for flexible and rigid-flex PCBs. Our extensive family of Pyralux®, Interra® and Temprion® branded products expands possibilities for flexible laminates, embedded passives and thermal performance in demanding applications such as 5G networks, electric vehicles, and consumer electronics. The Pyralux®, Interra® and Temprion® portfolios includes a diverse collection of core dielectric materials and customized constructions that enable:
Choose DuPont as your materials solutions partner to:
Laminates provide the backbone for increasingly complex circuits built on both rigid and flexible (flex) substrates. They provide mechanical integrity to flex circuits while allowing designers the freedom to fit circuits into the available footprint. All the materials in multilayer flex laminates must be chosen to combine mechanical flexibility with sufficient electrical performance.
The laminate market is evolving to support the needs of high-speed, high-frequency circuits that connect 5G networks and power the next generation of consumer electronics. Flexible laminates are used in smartphone antennas and configurations that require thin substrates with tight bending radii. Such applications need thin, flexible designs made from low-loss materials to ensure signal integrity.
Electric vehicles (EVs) for both the consumer automotive market and military applications require laminates that can withstand high service temperatures for use in power modules and transmission control units. The ability of flexible laminates to meet this requirement expands product design options.
Superior bond strength and flexibility for high volume applicationsView Details
DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.
DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications for over 35 years with a proven record of consistency and dependability.
DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products where uniform matte black appearance is desired.
DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.View Details
DuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing are required.
DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.
DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.
Pyralux® HT is an all polyimide bonding film with the highest service temperature available today and low loss performance when paired with Pyralux® AP.
DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.View Details
DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.