Printed Circuit Board Materials

Laminates

High-performance Flex & Rigid-Flex Laminates and Adhesive Systems

Pyralux Laminates for Flexible and Rigid-Flex PCBs

DuPont has long been a market leader in laminates for flexible and rigid-flex PCBs. Our extensive family of Pyralux®, Interra® and Temprion® branded products expands possibilities for flexible laminates, embedded passives and thermal performance in demanding applications such as 5G networks, electric vehicles, and consumer electronics. The Pyralux®, Interra® and Temprion® portfolios includes a diverse collection of core dielectric materials and customized constructions that enable:

  •   Low loss for high-speed, high-frequency applications
  •   High service temperature for automotive and aerospace applications
  •  Options for single and double-sided, multilayer flex, and rigid-flex designs

Choose DuPont as your materials solutions partner to:

  •  Provide you the highest performing laminates
  •  Achieve design flexibility while maintaining excellent signal integrity
  •   Tap into decades of technical expertise
  • Laminates provide the backbone for increasingly complex circuits built on both rigid and flexible (flex) substrates. They provide mechanical integrity to flex circuits while allowing designers the freedom to fit circuits into the available footprint. All the materials in multilayer flex laminates must be chosen to combine mechanical flexibility with sufficient electrical performance.

  • The laminate market is evolving to support the needs of high-speed, high-frequency circuits that connect 5G networks and power the next generation of consumer electronics. Flexible laminates are used in smartphone antennas and configurations that require thin substrates with tight bending radii. Such applications need thin, flexible designs made from low-loss materials to ensure signal integrity.

    Electric vehicles (EVs) for both the consumer automotive market and military applications require laminates that can withstand high service temperatures for use in power modules and transmission control units. The ability of flexible laminates to meet this requirement expands product design options.

Laminate Product Selector

Find the best product for your application.

Laminate Materials For PCBs

  • Acrylic-based Adhesive Solutions
  • All-Polyimide Solutions
  • Epoxy Adhesive Solutions
  • Fluoropolymer Adhesive Solutions
  • Thin Copper Clad Laminate

Acrylic-based Adhesive Solutions

Superior bond strength and flexibility for high volume applications

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Pyralux® FR

DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.

Pyralux® LF

DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications for over 35 years with a proven record of consistency and dependability.

Pyralux® LF-B

DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products where uniform matte black appearance is desired.


All-Polyimide Solutions

DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.

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Pyralux® APR

DuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing are required.

Pyralux® AC

DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.

Pyralux® AP

DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.

Pyralux® HT

Pyralux® HT is an all polyimide bonding film with the highest service temperature available today and low loss performance when paired with Pyralux® AP.


Epoxy Adhesive Solutions

Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.

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Pyralux® HXC

DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired.


Fluoropolymer Adhesive Solutions

DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.

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Pyralux® TK

DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.


Thin Copper Clad Laminate

Interra® thin copper clad laminates for embedded capacitance.

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Interra™ HK04J

DuPont™ Interra™ embedded planar capacitor laminate is used to make thinner, more efficient power and ground planes within a multilayer printed wiring board.