DuPont’s Innovative Material Solutions for Next-Level PCB Designs at IPC/APEX

 
 
 
 
 
 

DuPont Interconnect Solutions (ICS), a business within the Electronics & Industrial segment, will exhibit (Booth #341) at the 2023 edition of the Institute for Printed Circuits (IPC) APEX Exposition to be held in San Diego, CA from January 24 - 26, 2023.

This show is attended by North America’s largest audience engaged in electronics manufacturing. At IPC/APEX, DuPont ICS will engage with PCB fabricators, designers, OEM’s and EMS companies, showcasing its portfolio of innovative, more sustainable metallization and dry film material solutions for the PCB market. The ICS portfolio also includes thermal management and electromagnetic shielding solutions from the recently added Laird Performance Materials.

According to Erik Reddington, ICS West Commercial Leader for Metallization & Imaging, and Laminates, IC substrates are expected to be the fastest growing segment of the PCB industry in the coming years. Reddington says the changing technology in printed circuit boards is moving toward smaller vias and finer lines, along with a desire for more sustainable solutions. He says DuPont has continued to innovate and invest in new technologies to address the needs of PCB industry, becoming the leading total solutions and systems design partner addressing signal integrity and power transmission challenges while taking care of both people and the planet.

DuPont recently completed a $250 million Kapton® polyimide film manufacturing expansion in Circleville, Ohio which is further illustration of its commitment to expanding printed circuit board manufacturing in the United States and Europe. DuPont has joined the Printed Circuit Board Association of America (PCBAA), the consortium of U.S.-based companies that support U.S. domestic production of printed circuit boards. DuPont is using that involvement to better under the needs of the domestic PCB industry and develop solutions to enable next generation material advancements.

 
 
 

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