Innovations in advanced computing and artificial intelligence present design teams and manufacturers with myriad challenges in chip packaging and AI boards. To ensure reliable AI systems, high-performing materials are essential. Discover how DuPont's advanced interconnects and thermal management solutions support the next generation of AI technology, enabling innovation across logic chips, memory chips, PCBs, IC substrates, and more.

Demands for added functionality can require advanced & fine pitch PCBs, allowing more circuits in smaller spaces. High-density interconnects (HDI), advanced multi-layer boards, and innovative IC substrates all are accelerating demands for extreme PCB miniaturization. DuPont Interconnect Solutions ensures innovation has no boundaries and fabricators can create miniaturized yet reliable next-gen PCBs matching design requirements over the long term.

DuPont Electronics & Industrial makes next-generation technology a reality. Through industry-leading innovation, deep materials science expertise and large scale, best-in-class manufacturing we address our customers’ needs for innovative materials and connectivity – today and in the future. 

The chemical mechanical planarization (CMP) process is key to building circuitry for semiconductor devices. It’s a precise operation that enables microchips to process data faster and store large volumes of data while using less power. DuPont E&I’s expertise, commitment to collaboration, and specialized materials enable a wide range of applications, moving innovation forward.

In the electronics industry, high-performance chips require extremely small features—features that DuPont E&I’s photoresists support. Our ultra-high-purity manufacturing process and tight batch control result in high-quality resists that can be spread in very thin layers. Our production-proven photoresists are optimized for wavelengths from 436 nanometers all the way down to the smallest, 13.5 nanometers.