As design engineers work to make high-performance electronics more compact, powerful, and connected, thermal management is crucial. Higher power densities, tighter packaging, and increasing environmental and performance demands require advanced thermal solutions.
We offer a comprehensive portfolio of thermal management materials – from polyimide films to thermal gap fillers – that manage heat and reduce thermal resistance in electronic assemblies. Our materials are trusted across industries, including automotive, datacom and telecom, consumer electronics, and aerospace and defense. They offer high thermal conductivity, reliability at high temperatures, and automation readiness, supporting the long-term performance of AI boards, smartphones, electric vehicles and more.
Proven Materials. Practical Integration
Design engineers face growing thermal management challenges. For example, the use of gallium nitride and silicon carbide in semiconductors increases power densities and operating temperatures, raising performance requirements for thermal management materials. And tighter packaging forces design engineers to use solutions that address multiple challenges in one material, such as films that offer thermal conductivity but also function as a dielectric.
Our thermal management materials are engineered to meet these challenges. They offer a range of performance characteristics, mechanical properties, and form factors, helping enable optimal contact, consistent heat transfer, and robust long-term performance.
A Partner in Performance
In addition to our materials science expertise, we provide deep engineering expertise across our global footprint. Our teams work diligently to understand design goals, manufacturing constraints, and performance expectations. We then help designers specify the right solution and ensure smooth implementation across development, testing, and production.
We support customers at every stage, providing insight into manufacturability, automation readiness, and long-term reliability. The result: better thermal performance, faster time to market, and confidence in every application.
Our Kapton® polyimide films provide high-performance and proven reliability for managing heat and reducing thermal resistance. Bonded between a heat-generating component and a heat sink, these materials reduce thermal resistance to more effectively transfer thermal energy.
Used in applications spanning aerospace, industrial rail, automotive and consumer electronics industries, Kapton® polyimide films are designed to work reliably in harsh conditions. These solutions maintain electrical, thermal, mechanical, physical and chemical properties to reliably manage heat – enhancing performance and maximizing product lifetimes.
Laird Technologies is a world leader in high-performance thermal interface materials (TIM). As a thermal specialist, Laird leverages design experience and materials science expertise to develop innovative products that fill in air gaps and microscopic irregularities, resulting in significantly lower thermal resistance and improved cooling of hot components. With deep experience in solving thermal management challenges across industries, the Laird team offers a holistic view of thermal management, collaborating with customers on solution development and testing. And, with an extensive portfolio of TIMs, dedicated research and development, and a global manufacturing footprint, Laird delivers performance that is thermally advanced.
Thermal Gap Fillers
Laird™ thermal gap fillers fill in the spaces between electronic components and eliminate air pockets to aid thermal transfer and improve heat dissipation. Available in gap pads, one-part and two-part dispensable solutions – with both silicone and non-silicone-based offerings – these materials combine thermal conductivity and softness to address complex thermal challenges.
Laird is a world leader in high-performance thermal interface materials. The Laird™ branded suite of thermal gap fillers helps cool powerful components across industries, including 5G infrastructure, AI chips, automotive ADAS solutions, infotainment systems, smart home and wearable devices, drones and satellites, gaming systems, and more.
Laird offers fully automated application capabilities for its thermal gap pads and liquid gap fillers. Our optimized dispensing application ensures appropriate weight, location and surface coverage of dispensable gap fillers. Our TIM Pick™ solution for pick-and-place gap pads reduces total cost of ownership by improving cycle times, yields and placement accuracy.
See Laird’s portfolio of Gap Filler Pads
See Laird’s portfolio of Liquid Gap Fillers
High-Performance Materials
Laird’s high-performance phase change materials and thermal grease enhance thermal transfer between heat-generating components and heat sinks, helping electronic systems maintain cooler temperatures. These solutions work reliably in minimum bond line applications, providing the lowest possible thermal resistance to ensure reliable long-term performance.
Silicone and non-silicone-based thermal greases are designed to resist pump out and offer superior wetting characteristics. An innovative, new thermal gel offers engineers an all-in-one dispensable that can be used in both minimum bond line, constant pressure applications and as a thick gap filler in a constant gap application. And Laird™ phase change materials, designed to soften at operating temperatures between 50°C to 70°C, offer industry leading thermal performance, reliability and ease of use.
As manufacturers transition to next-generation compound semiconductors, Laird is developing new solutions that perform at the higher operating temperatures of these SiC and GaN semiconductors.
Poor gap filler-enabled contact between a heat source and a heat sink reduces product performance. Thermo-mechanical stresses and vibration during assembly can reduce contact. Read how the fast-rebounding characteristics of Laird™ Tflex™ HR6.5 thermal pad following its machine application compression help this advanced material quickly recover and retain low thermal resistance capabilities.
We love to talk about how our electronics solutions can build business, commercialize products,
and solve the challenges of our time.
