Thermal Management Materials


We’ve Put Thermal Resistance in Its Place

Effective heat management is key to optimum performance in electronic applications ranging from semiconductors to LED lighting. DuPont thermal management materials provide a high-quality, reliable choice for managing heat and reducing thermal resistance in a wide variety of electronic assemblies to enhance performance and extend product lifetime for a variety of applications.  

Available in a variety of formats—from films and adhesive thermal tapes to non-silicone greases and dispensable gap fillers—DuPont products are differentiated from the competition with either higher thermal conductivity, lower thermal resistance, improved handleability or improved thermal stability during continuous operation. 

All DuPont thermal management materials are designed to withstand the harsh conditions in today’s technologically advanced electronic devices and products while providing an excellent balance of electrical, thermal, mechanical, physical and chemical properties. 


Thermal Management Materials

  • Temprion® Thermal Management Materials

    Thermal management materials in the DuPont™ Temprion® family include films and adhesive thermal tapes.


    Featuring unrivaled thermal impedance (0.24 K·in2/W @ 30 psi) and best-in-class heat transfer, choose DuPont™ Temprion® electrical insulation film.

    Temprion® OHS organic heat spreader imbues a remarkably high thermal conductivity within the plane of the film, with no effect on thermal transfer through the film.

    Temprion® AT thermal adhesive tape is pressure sensitive, highly conformable and features best in class thermal conductivity.
  • Kapton® Thermal Management Materials

    DuPont ™ Kapton® thermal management materials provide high-performance and high reliability for managing heat and reducing thermal resistance


    These films with thermal conductivity of 0.45 W/m·K can be used alone or combined with other materials as a laminate for added functionality. Kapton® MT film comes in a variety of thicknesses, even as thin as a little over 25µm.

    These films with superior thermal conductivity of 0.8 W/m·K are available as thin as 38 µm up to 127 µm. Lowers operating temperature by 20–45°C in e-motors as a NKN slot liner. Increases power output by 10-30% for PTC heaters.
  • Thermal Interface Materials

    Our thermally conductive silicones are designed to handle the heat dissipation of today’s advanced electronic devices.


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