DuPont™ Riston® dry film photoresist revolutionized the way printed circuit boards were fabricated when it was invented by DuPont more than 40 years ago.
The original dry film photoresist invented by DuPont is the industry standard for high yield, productivity, and ease of use in all imaging applications. DuPont™ Riston® products meet the industry demands for finer features, higher quality and lower cost in all types of plating and etching applications.
The advanced fine line direct imaging photoresist solution for IC substrate application.
Better adhesion, resolution and chemical resistance performance to overcome design challenges from CSP and BGA application.
Used in tenting, plating, akaline etching or innerlayer applications.
Next Generation T/E and P/E direct imaging photoresist.
Excellent tenting, chemical resistance and wind operation window enable higher yield.
The advanced dry film photoresist for fine line HDI.
Fine line direct imaging photoresist solution for HDI mSAP application.
Superior resolution capability for HDI pitch 70~100µ m design (DI9000); Well balanced tenting and resolution capability to meet both Inner layer and outer layer design requirement (DI8600).
The advanced solution for fine line FPC design.
The advanced solution for tall copper pillar process in advanced packaging application.
Various thickness offering (50µ m ~ 240 µ m) with better via resolution capability to meet future design challenges.
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