Electronics & Industrial Advanced Computing
We’re making advanced computing possible – today.
As advanced computing reshapes our lives, DuPont’s solutions enable innovations essential for artificial intelligence, from chip fabrication to packaging and assembly. With a comprehensive product portfolio, DuPont has built powerhouses of semiconductor materials, advanced interconnects and thermal management – making breakthroughs in advanced computing and AI possible.
Our team can help with solutions for advanced logic and memory chip designs, advanced packaging, IC substrates, PCBs, and assembly. DuPont is dedicated to transforming the landscape of advanced computing technology through innovative materials that address emerging demands and enable our customers’ success now and in the future.
Powerhouse of Advanced Interconnects
A multitude of design challenges span chip packaging and the entire AI board – from fitting high-powered components and establishing interconnections in tight spaces to creating multilayer boards, stacking dies, and enabling fine-pitch design.
To ensure signal integrity, thermal stability, mechanical reliability and high performance in chip packages and on AI boards, design teams and manufacturers need total solutions. DuPont develops and manufactures products of unmatched quality and reliability under two powerhouse portfolios, advanced interconnect and thermal management, that address the complex performance demands of AI chip packaging and boards and enable future innovation.
Explore our advanced computing and AI solutions and discover what’s possible.
Semiconductor Fabrication and Packaging Materials
End-to-end materials solutions to support the semiconductor manufacturing process
DuPont’s rich history of experience and innovation has deep roots in the semiconductor fabrication industry. Our broad portfolio and expertise support many segments, from advanced chip manufacturing processes, to advanced packaging and assembly, to compound semiconductor device fabrication.
We offer complementary, reliable, high-quality materials sets to support both today’s high-volume manufacturing processes and advanced technology for the future. Through close collaboration with our customers, we develop solutions to address leading-edge technology challenges that are critical to advancing diverse market drivers. We work with our customers to develop or place materials that meet their specific needs, including technical performance and cost-of-ownership improvements.
Our materials are valuable building blocks for today’s advanced microelectronics found in everything from consumer electronics to high-end data centers, automotive applications, medical devices, the Internet of Things, artificial intelligence, power electronics and more.
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What are Semiconductor Fabrication Materials?
At DuPont, we define semiconductor fabrication materials as chemistries and other products critical for wafer processing in the fabrication of silicon die, including microlithography, chemical mechanical planarization, and cleaning solutions, through to advanced wafer-level packaging processes, as well as other related technologies.
Semiconductor Materials
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Materials for Chemical Mechanical Planarization (CMP)
Materials for Chemical Mechanical Planarization (CMP)
CMP pads and slurries tailored to each customer's needs
- CMP Slurries
A range of offerings for chemical mechanical planarization (CMP) including Novaplane™, Optiplane™, Acuplane™ and Klebosol® slurries. -
Lithography Materials and Services
Lithography Materials and Services
Learn how DuPont develops and delivers market-leading lithography materials to support semiconductor advanced patterning.
- Photoresists
DuPont’s robust, production-proven photoresist product line offers materials options that meet the requirements across generations of lithography processes.- Anti-Reflectants & Functional Sublayers
Anti-reflective coatings and sublayers boost the effectiveness of lithography by widening and improving the process and reflectivity windows.- Advanced Overcoats
Used in conjunction with photoresists, DuPont’s advanced overcoat materials are designed to prevent defects and improve the lithography process window, enabling finer feature patterns.- Ancillary Lithography Materials
DuPont’s roots run deep in its production-proven line of ancillary lithography products. From developers, removers, and other enhancement chemistries, we support a total lithography solution.- Electronic Grade Polymers | DuPont Electronic Solutions
DUV and 193nm photoresist performance begins with the polymer, and DuPont electronic grade polymers continue to improve upon existing techniques for polymer manufacture, isolation, and evaluation.- Metrology & Imaging Services
We offer services such as defect testing or patterning wafers. -
EKC® Specialized Removers and Clean Chemistries
EKC® Specialized Removers and Clean Chemistries
Specialty removal and clean chemistries for use in post-chemical mechanical polishing (CMP) and post-etch processes.
- Post-CMP Cleaners
Learn about our post-CMP copper interconnect cleaner required in the manufacturing of advanced semiconductor devices.- Post-Etch Residue Removers
Aqueous & semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.- Removers for LED Fabrication
Enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts.- WLP Photoresist Removers & TSV Cleaners
Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printing. -
Dual Damascene Copper
Dual Damascene Copper
Since 2006, leading-edge semiconductor manufacturers have relied upon DuPont Electronics & Imaging's dual damascene products for achieving semiconductor technology nodes below 20nm. What's our secret?
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Semiconductor Packaging Materials
Semiconductor Packaging Materials
With more than 50 years invested in technology development, DuPont Electronics & Imaging understands the needs in the market and has developed a broad portfolio of semiconductor packaging materials for a range of technology areas.
- Bump Plating Photoresists
DuPont offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.- Copper Pillar Plating
Our production-proven Copper pillar formulations work in perfect harmony with our under-bump metallization (UBM) and tin-silver capping chemistries, to provide a seamless solution for all your Copper pillar needs.- Copper Redistribution Layer
DuPont Electronics & Industrial copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.- Packaging Dielectrics
Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.- Solder Bump Plating
DuPont’s award-winning Solderon™ BP electroplating chemistries are a reliable alternative to tin-lead alloys for all wafer bumping applications.- Through Silicon Via Copper
Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.- Under Bump Metallization
We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs. -
Semiconductor Assembly Materials
Semiconductor Assembly Materials
By working in collaboration with leading-edge packaging and assembly houses, DuPont Electronics & Imaging sets the bar for excellence. Our materials are developed based on the latest requirements and are proven in high-volume manufacturing.
- Die Attach Adhesives
Ordinary die-attach adhesives suit ordinary chip applications. But when a chip design must deliver reliable performance in extreme temperatures, high moisture, or stressful environments look to DuPont Electronics & Industrial for extraordinary solutions.- Die Encapsulants
Our silicone die encapsulants maintain reliable performance even at the high reflow temperatures required for lead-free solder processing or stringent thermal stress-reliability testing conditions.- Lid Seal Adhesives
DuPont’s portfolio of silicone-based lid-seal adhesives are designed to handle the high functionality of today’s advanced packaging processes, delivering the performance needed for today’s high-performance computing, mobile and automotive electronic applications.- Permanent Bonding Dielectrics
Photo-patternable dielectrics and non-photo-patternable adhesives make possible chip-to-wafer and wafer-to-wafer stacking for heterogeneous integration.- Thermal Interface Materials
Our thermally conductive silicones are designed to handle the heat dissipation of today’s advanced electronic devices. -
Semiconductor Silicone Materials
Semiconductor Silicone Materials
These materials are essential to a number of semiconductor process steps. They include chemical vapor deposition (CVD)/atomic layer deposition (ALD) gas/precursor, and spin-on dielectrics (SOD).
- Si Precursors
Silicon precursors are high-purity gas or liquid materials used in key steps during the manufacture of semiconductor devices.- Spin-on dielectrics
Spin-on dielectric materials to make multilevel metal ICs more planar, reducing process complexity and cost.
We’re here to help.
We love to talk about how our electronics solutions can build business, commercialize products,
and solve the challenges of our time.