Laminates and Adhesive Systems


High-performance Flex & Rigid-Flex Laminates and Adhesive Systems

Pyralux Laminates for Flexible and Rigid-Flex PCBs

DuPont has long been a market leader in laminates for flexible and rigid-flex PCBs. Our extensive family of Pyralux®, Interra® and Temprion® branded products expands possibilities for flexible laminates, embedded passives and thermal performance in demanding applications such as 5G networks, electric vehicles, and consumer electronics. The Pyralux®, Interra® and Temprion® portfolios includes a diverse collection of core dielectric materials and customized constructions that enable:

  •   Low loss for high-speed, high-frequency applications
  •   High service temperature for automotive and aerospace applications
  •  Options for single and double-sided, multilayer flex, and rigid-flex designs


Choose DuPont as your materials solutions partner to:

  •  Provide you the highest performing laminates
  •  Achieve design flexibility while maintaining excellent signal integrity
  •   Tap into decades of technical expertise
  • Laminates provide the backbone for increasingly complex circuits built on both rigid and flexible (flex) substrates. They provide mechanical integrity to flex circuits while allowing designers the freedom to fit circuits into the available footprint. All the materials in multilayer flex laminates must be chosen to combine mechanical flexibility with sufficient electrical performance.

  • The laminate market is evolving to support the needs of high-speed, high-frequency circuits that connect 5G networks and power the next generation of consumer electronics. Flexible laminates are used in smartphone antennas and configurations that require thin substrates with tight bending radii. Such applications need thin, flexible designs made from low-loss materials to ensure signal integrity.

    Electric vehicles (EVs) for both the consumer automotive market and military applications require laminates that can withstand high service temperatures for use in power modules and transmission control units. The ability of flexible laminates to meet this requirement expands product design options.


Laminate Product Selector

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Laminate Materials For PCBs

  • Acrylic-based Adhesive Solutions

    Superior bond strength and flexibility for high volume applications

    DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.

    DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.

    DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products where uniform matte black appearance is desired.
  • All-Polyimide Solutions

    DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.

    DuPont™ Pyralux® AG is an all-polyimide double sided copper clad laminate that is offered in both sheets and rolls with global availability and is ideal for use in high volume consumer, medical and automotive applications.
    DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties. It is ideal for use in rigid flex and multilayer flex applications which require advanced performance, such as low dissipation loss for high speed, high frequency, thermal resistance and high reliability.
    DuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing are required.
    DuPont™ Pyralux® TA series are all polyimide copper clad laminates designed for high speed high frequency applications. Paired offerings of double sided and single sided clads enable multi-layer construction of antenna and feedlines with good material compatibility
  • Epoxy Adhesive Solutions

    Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.

    Pyralux® GPL Sheet Adhesive is a proprietary B-staged modified epoxy adhesive and is primarily utilized to bond flexible inner layers or rigid cap layers in flexible and rigid-flex constructions..

    DuPont™ Pyralux® HXI is DuPont™ Kapton® black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It offers thinner construction than Pyralux® HXC, but similar mechanical and process properties.

    DuPont™ Pyralux® HP is an epoxy-based adhesive system demonstrating both low loss and high reliability, specifically designed for OEMs and PCB design manufacturers. Its optimized low-loss solution is suitable for multi-layer flex and rigid-flex designs for military, automotive and medical industries. Pyralux® HP adhesive provides best-in-class insertion loss performance, increased functionality and ease of processing while maintaining high reliability. 

    DuPont™ Pyralux® HXC Black Coverlay features DuPont™ Kapton® MBC, matte black polyimide film, for high performance applications where design aesthetics are critical. This product is coated on one side with a proprietary B-staged modified epoxy adhesive. Pyralux® HXC Coverlay can be used to encapsulate etched details in flexible and rigid-flex multilayer constructions for environmental protection and electrical insulation. Black coverlay is also commonly used to enhance circuit aesthetics and improve LED lighting controls in specialty applications
  • Fluoropolymer Adhesive Solutions

    DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.

    DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.
  • Embedded Capacitor Laminate

    Interra® embedded capacitor laminate

    DuPont™ Interra® embedded planar capacitor laminate is used to make thinner, more efficient power and ground planes within a multilayer printed wiring board.

    Interra® HK04M is DuPont’s next generation embedded capacitance laminate, which has been optimized to handle thinner dielectric layers and further reduce the impedance between power and ground planes in a printed wiring board.

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