DuPont has long been a market leader in laminates for flexible and rigid-flex PCBs. Our extensive family of Pyralux®, Interra® and Temprion® branded products expands possibilities for flexible laminates, embedded passives and thermal performance in demanding applications such as 5G networks, electric vehicles, and consumer electronics. The Pyralux®, Interra® and Temprion® portfolios includes a diverse collection of core dielectric materials and customized constructions that enable:
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Laminates provide the backbone for increasingly complex circuits built on both rigid and flexible (flex) substrates. They provide mechanical integrity to flex circuits while allowing designers the freedom to fit circuits into the available footprint. All the materials in multilayer flex laminates must be chosen to combine mechanical flexibility with sufficient electrical performance.
The laminate market is evolving to support the needs of high-speed, high-frequency circuits that connect 5G networks and power the next generation of consumer electronics. Flexible laminates are used in smartphone antennas and configurations that require thin substrates with tight bending radii. Such applications need thin, flexible designs made from low-loss materials to ensure signal integrity.
Electric vehicles (EVs) for both the consumer automotive market and military applications require laminates that can withstand high service temperatures for use in power modules and transmission control units. The ability of flexible laminates to meet this requirement expands product design options.
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Superior bond strength and flexibility for high volume applications
DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.
Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.
DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.
Interra® thin copper clad laminates for embedded capacitance.