DuPont’s rich history of experience and innovation has deep roots in the semiconductor fabrication industry. Our broad portfolio and expertise support many segments, from advanced chip manufacturing processes, to advanced packaging and assembly, to compound semiconductor device fabrication.
We offer complementary, reliable, high-quality materials sets to support both today’s high-volume manufacturing processes and advanced technology for the future. Through close collaboration with our customers, we develop solutions to address leading-edge technology challenges that are critical to advancing diverse market drivers. We work with our customers to develop or place materials that meet their specific needs, including technical performance and cost-of-ownership improvements.
Our materials are valuable building blocks for today’s advanced microelectronics found in everything from consumer electronics to high-end data centers, automotive applications, medical devices, the Internet of Things, artificial intelligence, power electronics and more.
At DuPont, we define semiconductor fabrication materials as chemistries and other products critical for wafer processing in the fabrication of silicon die, including microlithography, chemical mechanical planarization, and cleaning solutions, through to advanced wafer-level packaging processes, as well as other related technologies.
CMP pads and slurries tailored to each customer's needs
Learn how DuPont develops and delivers market-leading lithography materials to support semiconductor advanced patterning.
Specialty removal and clean chemistries for use in post-chemical mechanical polishing (CMP) and post-etch processes.
Since 2006, leading-edge semiconductor manufacturers have relied upon DuPont Electronics & Industrial's dual damascene products for achieving semiconductor technology nodes below 20nm. What's our secret?
With more than 50 years invested in technology development, DuPont Electronics & Industrial understands the needs in the market and has developed a broad portfolio of semiconductor packaging materials for a range of technology areas.
By working in collaboration with leading-edge packaging and assembly houses, DuPont Electronics & Industrial sets the bar for excellence. Our materials are developed based on the latest requirements and are proven in high-volume manufacturing.
These materials are essential to a number of semiconductor process steps. They include chemical vapor deposition (CVD)/atomic layer deposition (ALD) gas/precursor, and spin-on dielectrics (SOD).