DuPont's wealth of metallization options allows us to provide you with a metallization that will be compatible with your chosen dielectric. We keep up with trends in IC packaging and understand the need for cost-effective solutions that enhance package reliability. DuPont offers:
We specialize in pure copper plating for more reliable interconnect on substrates for ball grid arrays (BGA) and chip scale packages (CSP). High throwing power leads to excellent thickness distribution. Even coverage over substrates with complex geometry ensures the highest degree of reliability.
Choose DuPont as your materials solutions partner to give you:
Supporting IC Substrate Development with Advanced Materials Technology
Copper plating solutions for substrates in all types of advanced packages.
Metallization to enable high-performance rigid PCBs.
Our highly conformal copper plating will enable any HDI design to perform well.
Copper plating to meet the demands of flexible PCBs.
Immersion tin for TAB and COF manufacturing.