Latest News
DuPont Taiwan Receives National Enterprise Environmental Protection Award
Environmental Protection Administration recognizes DuPont Hsinchu Manufacturing and Technology Site for corporate social responsibility.
Read Article 10.02.19Sang-Ho Kang Named Global Business Director for Semiconductor Technologies in DuPont Electronics & Imaging
Semiconductor Technologies is a global leader in materials for the integrated circuit fabrication market.
Read Article 10.02.19DuPont Celebrates Groundbreaking for Circleville Expansion
DuPont Electronics & Imaging hosted a groundbreaking ceremony to celebrate the planned $220 million expansion at its Circleville, Ohio, plant.
Read Article 09.18.19DuPont Electronics & Imaging completes new plant in Cheonan in Korea to produce liquid polyimide for flexible display substrates
New plant designed to meet fast-growing demand for liquid PI for flexible display substrates.
Read Article 09.12.19Three Talented DuPont Employees Named to Delaware 40 Under 40 List
Delaware Business Times Recognizes DuPont Electronics & Imaging’s Murali Theivanayagam, Sandhya Thiyagarajan and Lea Williams on 2019 DBT40 List
Read Article 09.10.19DuPont Electronics & Imaging Divests Compound Semiconductor Solutions Business to SK Siltron
DuPont today announced it has signed an agreement to sell its Compound Semiconductor Solutions (CSS) business to SK Siltron, based in South Korea.
Read Article 06.27.19DuPont Electronics & Imaging Introduces Three New Cleaning Chemistries for Advanced Semiconductor Fabrication
DuPont’s EKC Technology portfolio expands with novel formulations for post-CMP cleaning and post-etch residue removal to support advanced semiconductor fabrication.
Read Article 06.12.19DuPont Unveils Smart Conference Table
DuPont Electronics & Imaging announced today it is introducing a first-of-its-kind Smart Conference Table, a complete communications solution for collaborative spaces.
Read Article 06.11.19DuPont Electronics & Imaging's Mingqi Li to Receive AAEOY Engineer of the Year Award
DuPont Electronics & Imaging is proud to announce that Mingqi Li, Ph.D., principal research scientist, has been selected by the Asian American Engineer of the Year Award (AAEOY) program as one of the recipients of its 2019 Engineer of the Year Award.
Read Article 03.06.19DuPont to Invest in New Production Assets for Kapton® and Pyralux®
The expansion to meet growing market demand in automotive, consumer electronics, telecom and defense.
Read Article 11.02.18China R&D Center Enhances Lab Capabilities to Support Customers with Chemical Mechanical Planarization (CMP) Processes
The lab expansion will be used to provide timely service to local customers such as CMP pad analysis to help them optimize their production processes.
Read Article 10.04.18Peter Trefonas Inducted into National Academy of Engineering
Trefonas was recognized for his significant inventions in photoresist materials and microlithography methods that underpin multiple generations of semiconductor manufacturing processes.
Read Article 09.27.18DuPont Electronics & Imaging’s Bryan Barton & Elaine Masser Honored Among Delaware’s Top Young Professionals
Each year, Delaware Business Times organizes the DBT40 awards, a carefully curated group of 40 of Delaware’s brightest and most accomplished early career professionals, all under the age of 40.
Read Article 09.25.18DuPont Electronics & Imaging Opens Technology Center to Support Innovation in Silicon Valley
The Technology Center will serve as a hub for the DowDuPont Specialty Products Division businesses to tackle customer challenges with applications support, rapid prototyping, and more.
Read Article 09.12.18DuPont Electronics & Imaging Announces Newest In-Mold Electronics Inks
DuPont today announced that it is launching its second generation of In-Mold Electronic (IME) materials with key advancements in its electrically conductive adhesive, protection encapsulant and crossover dielectric.
Read Article 03.26.18Dow Electronic Materials Expands Its Asia CMP Manufacturing and Technical Center in Hsinchu
The expansion adds capacity for the production of CMP polishing pads and adds the ability to create new products, such as advanced CMP pads targeting very specific customer requests.
Read Article 02.22.18Peter Trefonas Elected SPIE Fellow
Peter Trefonas, Ph.D., corporate fellow, has recently been elected a Fellow of SPIE, for achievements in design for manufacturing and compact modeling.
Read Article 01.25.18Intexar™ Heat Enables Thin, Safe and Efficient Heated Garments
Intexar™ Heat is a thin lightweight and durable heating solution for outdoor clothing that is designed to be easily integrated into garments.
Read Article 01.17.18DuPont Introduces Intexar™ Smart Clothing Technology at Wearable Expo in Japan
Intexar™ transforms ordinary fabrics into active, connected, intelligent garments that enable critical biometric data collection including heart rate, breathing rate, form awareness and muscle tension.
Read Article 08.02.17DuPont Litho Technologies Receives SMIC's Best Technical Supplier Award
China's largest semiconductor foundry recognizes the team's commitment to customer satisfaction.
Read Article 07.25.17DuPont Unveils Newest Smart Clothing Technology at Outdoor Retailer Show
Intexar™ is seamlessly embedded directly onto fabric using standard apparel manufacturing processes to create thin, form-fitting circuits.
Read Article 04.26.17DuPont Awarded Expanded Global Patents for Kapton® Matte Black Film and Coverlay
DuPont announced today that it has expanded its worldwide patent estate related to DuPont™ Kapton® black polyimide film, and DuPont™ Pyralux® black flexible circuit materials.
Read Article 04.13.17James Thackeray Named SPIE fellow
Dr. Thackeray was named SPIE Fellow for his achievements in lithography materials development over the past decade, many of which have helped enable Moore’s law.
Read Article 01.18.17DuPont Collaborates with Industry Pioneers to Showcase Advanced Wearable Electronics
The DuPont materials have been used to create thin, form-fitting circuits that can be seamlessly bonded with many standard fabrics, allowing for comfort and freedom in wearable electronic design.
Read Article 11.03.16DuPont Launches New Portfolio of Electronic Thermal Management Solutions
DuPont Electronic Materials today announced the launch of a new portfolio of thermal solutions under the brand name DuPont™ Temprion™ thermal management materials.
Read Article 06.22.16Dow Electronic Materials Celebrates Expansion of Taiwan Site with Groundbreaking Ceremony
The ceremony marks the beginning of construction on a significant expansion project to increase production capacity for materials for chemical mechanical planarization (CMP).
Read Article 06.07.16Dow Launches Optiplane™ CMP Slurry Platform for Advanced Semiconductor Manufacturing
The Optiplane™ slurry family was developed to satisfy customer demand for advanced slurries that can meet defect reduction requirements and tighter specifications at a competitive cost.
Read Article 05.05.16Dow’s Peter Trefonas, Ph.D., to Receive Prestigious Perkin Medal
This honor recognizes Trefonas’ contributions in the development of chemicals that enable microlithography for the fabrication of microelectronic circuits.
Read Article 04.05.16DuPont Advanced Materials Introduces New Conductive Ink for Digital Printing
The technology will enable digital printing for electronic components and circuits in applications where extremely fine lines are required, such as OLED panels, solar cells, printed antennae and touch panels.
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