Artificial intelligence is reshaping our lives and work. But a look behind the curtain at AI innovation reveals complex hurdles design teams and manufacturers must overcome to enable future performance gains. The challenges span the entire AI board – from fitting high-powered components and making interconnections in tight spaces to creating multilayer boards and stacking dies to enabling more electrical connections using fine-pitch design.

To ensure signal integrity, thermal stability, mechanical reliability and high performance on AI boards, design teams and manufacturers need total solutions. DuPont Interconnect Solutions develops and manufactures products of unmatched quality and reliability that address the complex performance demands of AI boards and enable future innovation.