Circuposit™ LC-9100 Electroless Copper is an integral part of the Circuposit™ PTH Low-build Electroless Copper Process, DuPont’s Electronic Solutions' unique, patented process that defines a new standard for low-build through-hole plating.
This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space, increasing process speed, and improving reliability and quality.
Circuposit™ LC-9100 Electroless Copper offers ease of process control operation; low cost and built- in process flexibility available to the marketplace.
|Laminate||Normal Tg||Mid Tg||High Tg||Halogen Free|
Table 1: Excellent coverage on various laminates
Graph 1: Less Catalyst consumption contributes to cost effective