Circuposit™ LC-9100 Electroless Copper is an integral part of the Circuposit™ PTH Low-build Electroless Copper Process, DuPont’s Electronic Solutions' unique, patented process that defines a new standard for low-build through-hole plating.
This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space, increasing process speed, and improving reliability and quality.
Circuposit™ LC-9100 Electroless Copper offers ease of process control operation; low cost and built- in process flexibility available to the marketplace.
Advantages:
- Excellent coverage: on normal, high Tg, and halogen-free materials.
- Outstanding reliability performance
- Stable working bath; simple and safe process
- Easy to operate/analyze, and no long activating time
- Cost effective from less consumption, especially from Pd
| Laminate | Normal Tg | Mid Tg | High Tg | Halogen Free | ||
| S1141 | IT158 | TUC662 | Polyclad 370HR | S1000-2 | NPG | |
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Table 1: Excellent coverage on various laminates
Graph 1: Less Catalyst consumption contributes to cost effective
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