Circuposit™ SAP8000 Electroless Copper


New generation SAP electroless copper for IC substrate

Circuposit™ SAP8000 is designed for advanced package, e.g. high-end CPU or GPU which requires low roughness dielectrics and low Dk and Df properties for fine line and high frequency design.


  • Designed for FCBGA: applicable for low roughness dielectric
  • Coverage: good electroless copper coverage and smooth morphology for different laminates materials  
  • Reliability:high reliability performance on blind via (QVP, TCT test)
  • Stability: excellent catalyst and electroless copper bath stability


  • Advanced package substrate

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