Conductron™ DP/DP-H Direct Plate Process


Conductron™ DP / DP-H Direct Plate are processes especially designed for operation in vertical and horizontal equipment respectively. The Conductron™ Process can be applied for panel plating as well as pattern plating. The system is suitable for double sided, flex/rigid-flex as well as multilayer boards.

Key Benefits:

  • Provides excellent copper-to-copper adhesion
  • Short processing time
  • Simplified process control
  • Low process chemical consumption
  • Reduced chelate content for easy waste treatment
  • Formaldehyde-Free
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