The advanced solution for high speed direct current copper pillar technology
Copper Gleam™ CP360/CP360 Plus acid copper is designed for copper pillar applications with high plating speed and excellent deposit uniformity. As a three-component system, chemical is able to fine tune deposit morphology across a wide variety of Cu pillar feature sizes, while maintaining with-in unit and with-in panel uniformity and void free performance.
Advantages:
- Flat pillar top with excellent panel uniformity
- Operate at high current density up to 20 ASD
- Pure deposition with excellent reliability performance (ex: no K-voids)
Applications:
- Work for various copper pillar designs, such as 24-200 µm height
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