Copper Gleam™ CP360/CP360 Plus Acid Copper


The advanced solution for high speed direct current copper pillar technology

Copper Gleam™ CP360/CP360 Plus acid copper is designed for copper pillar applications with high plating speed and excellent deposit uniformity. As a three-component system, chemical is able to fine tune deposit morphology across a wide variety of Cu pillar feature sizes, while maintaining with-in unit and with-in panel uniformity and void free performance.


  • Flat pillar top with excellent panel uniformity 
  • Operate at high current density up to 20 ASD
  • Pure deposition with excellent reliability performance (ex: no K-voids)


  • Work for various copper pillar designs, such as 24-200 µm height

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