Copper Gleam™ HV-101 & HV-606 Electrolytic Copper


Copper Gleam™ HV-101 and HV-606 electrolytic coppers are the latest offerings for panel plating in Vertical-in-Line equipment. They deliver high plating efficiency to improve productivity and reduce cost.

The Copper Gleam™ HV-606 bath has been developed to work with insoluble anodes to deliver high plating performance at high current densities.

Key Benefits:

  • Excellent throwing power on through-holes and microvias
  • Exceptional panel plating distribution
  • Exceptional leveling performance on panel surface and inside through holes
  • Round plated shape on via bottom
  • Good thermal reliability

                                             Excellent Throwing Power

Exceptional levelling


Ideal Microvia
Bottom Shape


We’re here to help.

We love to talk about how our electronics solutions can build business, commercialize products,
and solve the challenges of our time.