Copper Gleam™ HV-101 and HV-606 electrolytic coppers are the latest offerings for panel plating in Vertical-in-Line equipment. They deliver high plating efficiency to improve productivity and reduce cost.
The Copper Gleam™ HV-606 bath has been developed to work with insoluble anodes to deliver high plating performance at high current densities.
Key Benefits:
- Excellent throwing power on through-holes and microvias
- Exceptional panel plating distribution
- Exceptional leveling performance on panel surface and inside through holes
- Round plated shape on via bottom
- Good thermal reliability
Excellent Throwing Power
Exceptional levelling
Ideal Microvia
Bottom Shape
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