Pallamerse™ SMT 2000 Electroless Palladium

 
 
 

Pallamerse™ Electroless Palladium is an electroless palladium process specifically formulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PWBs. The Pallamerse™ is an autocatalytic palladium process capable of depositing palladium coatings onto electroless nickel to meet subsequent SMT assembly requirements.

Key Benefits:

  • High bath stability
  • Uniform Deposits
  • Bondable with gold, copper and aluminum wire
  • Excellent solderability
  • Cost-effective alternative to electrolytic nickel-gold
  • RoHS compliant
 
 
 
 
 
 
 
 
 
 
 
 

We’re here to help.

We love to talk about how our electronics solutions can build business, commercialize products,
and solve the challenges of our time.

 
 
 
-