Pallamerse™ SMT 2000 Electroless Palladium


Pallamerse™ Electroless Palladium is an electroless palladium process specifically formulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PWBs. The Pallamerse™ is an autocatalytic palladium process capable of depositing palladium coatings onto electroless nickel to meet subsequent SMT assembly requirements.

Key Benefits:

  • High bath stability
  • Uniform Deposits
  • Bondable with gold, copper and aluminum wire
  • Excellent solderability
  • Cost-effective alternative to electrolytic nickel-gold
  • RoHS compliant

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