Riston® DI1500 & DI1600 Dry Film Photoresist
The advanced fine line direct imaging photoresist solution for IC substrate application
Advantages:
- Excellent fine line adhesion and resolution
- Outstanding low trace void performance
- Excellent chemical resistance to plating process for high yield productivity
- Superior conformation providing solutions to improve short related defect for high yield productivity
DI1525
x/x = 5/5µm Resolution
x/3x = 5/15µm Adhesion
DI1625
x/x = 5/5µm Resolution
x/5x = 5/25µm Adhesion
Applications:
- Advanced dry film photoresist for mSAP and SAP fine pitch IC substrate application
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