To achieve the lowest levels of thermal impedance, thermal interface materials often require high levels of mechanical pressure. DuPont™ Temprion® AT adhesive thermal tape breaks this trend by delivering grease-like wettability at low application pressures, providing users with the freedom to assemble their devices without introducing excess stress to the complex circuitry of their systems.
This line of highly conformable pressure-sensitive adhesive tapes achieves low thermal impedance at only 20 psi of pressure to offer best-in-class thermal performance, easier package assembly, reduced device failure and higher system performance.
Efficient thermal transfer through Temprion® AT lowers the operating temperature of a TO-220 package when dissipating 15 W/cm2
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