DuPont Launches ULTRAFILL™ 6001 Dual Damascene Copper Plating Bath for Back End of Line (BEOL) Metallization in Semiconductor Fabrication

Press Release | March 30, 2023
Press Release
DuPont Launches ULTRAFILL™ 6001 Dual Damascene Copper Plating Bath for Back End of Line (BEOL) Metallization in Semiconductor Fabrication

New additives used in DuPont™ ULTRAFILL™ 6001 deliver outstanding gap-fill capability to achieve a higher device yield and reliability for advanced semiconductor nodes

MARLBOROUGH, Mass., March 30, 2023 – DuPont Electronics & Industrial today announced its new ULTRAFILL™ 6001 dual damascene copper offering for semiconductor fabrication. This latest addition to the family of DuPont™ ULTRAFILL™ and NANOPLATE™ series of dual damascene copper plating baths is specially designed to enable back end of line (BEOL) electroplating process for copper interconnects in the range of tens to hundreds of nanometers and is suitable for lower, middle and upper metal layers. 

BEOL is the second major stage of the semiconductor fabrication process where tiny wiring schemes are formed as interconnects within the device. As the semiconductor industry continues to shrink technology nodes, dual damascene products that deliver strong gap-fill performance to meet key process and reliability requirements become even more critical to enabling the scaling roadmap for interconnects.

The DuPont™ ULTRAFILL™ line of dual damascene copper products is known for producing copper film deposits with high purity and low stress to deliver consistent, reproducible void-free filling. The latest dual damascene copper plating bath, ULTRAFILL™ 6001, is formulated with a new organic additive platform that demonstrates improved gap-fill capability, enhanced wettability, and a higher degree of leveling and mounding control, to enable the copper plating process for even finer feature sizes in the circuitry.

"For more than 10 years, leading-edge semiconductor manufacturers have relied upon DuPont’s dual damascene products for achieving semiconductor technology nodes below 20 nm,” said Shashi Gupta, global marketing director, Advanced Packaging Technologies, DuPont Electronics & Industrial. “With proven performance in high-volume manufacturing, our products can achieve void-free bottom-up fill with minimum overburden, and we will continue to look for ways to innovate as we enable back end of line advanced metallization processes and support the trend towards miniaturization.”

Interested customers should contact their DuPont Electronics & Industrial account managers to learn more about ULTRAFILL™ 6001 and other materials in the ULTRAFILL™ and NANOPLATE™ family. 

About DuPont Electronics & Industrial

DuPont Electronics & Industrial is a global supplier of new technologies and performance materials serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial and transportation industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products and technical service to enable next-generation technologies.  

About DuPont

DuPont (NYSE: DD) is a global innovation leader with technology-based materials, ingredients and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, health and wellness, food, and worker safety. More information can be found at

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