Aluminum Post-etch Residue Removers (PERR)

DuPont’s post-etch residue removers are aqueous and semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes. Post-etch residue removers (PERR) are part of the core product offering from our EKC Technology portfolio.

 

PlasmaSolv® Products - HDA® Technology

PlasmaSolv® products are designed to remove post-etch residue. These products perform at low operating temperatures, well below the flashpoint of the chemistry, providing a safe chemical process as well as extending bath life.

EKC® 245 PERR
EKC® 245 PERR is specifically designed to clean post-etch residues generated during the volume production of high capacity DRAM devices. It is also used to clean HBr-etched polysilicon and is able to remove residues after metal etch.

EKC® 265 PERR
EKC® 265 PERR was the initial product in the PlasmaSolv® series formulated to remove photoresist residue generated after etch processes. It is effective with or without oxygen ash processing.

EKC® 270 PERR
EKC® 270 PERR is a post-etch residue remover with improved Ti compatibility. It is formulated to remove ashed photoresist residue, organic polymer, and organometallic etch residue while maintaining optimum metal stack integrity.

EKC® 270-T PERR
EKC® 270-T PERR is an aqueous/organic mixture designed to remove post-etch or post-ash residues on conventional Al/Cu interconnect designs.

 

Copper Integration Technology

CuSolve™ products are copper compatible cleaning products formulated specifically for advanced designs integrating copper. These products remove photoresist and copper containing residues in the presence of exposed copper and low-k materials.

 

SAC™ (Semi-Aqueous Chemistry) Remover

The SAC™ (semi-aqueous chemistry) series of products comprise one of the industry’s most effective solution to the cleaning of etch residue at or below critical dimensions of 0.25µm. Used at ambient temperature for short process times, SAC™ products eliminate W plug failures and facilitate advanced interconnect by complete cleaning of both subtractive etch and damascene structures.

EKC® 652 SAC™
EKC® 652 SAC™ is a semi-aqueous formulation that removes post-etch residue quickly and effectively from substrates containing traditional integration materials.

EKC® 4000 PCT Post-Clean Treatment
EKC® 4000 PCT is a cost-effective replacement that outperforms conventional "rinse" chemistries such as IPA and NMP. It quickly and effectively eliminates corrosion on the wafer surface caused by drag-out (carry over) of chemistry from prior wet cleaning. EKC® 4000 PCT is compatible with automatic equipment and is formulated to meet ULSI grade specifications for advanced wafer treatment.