AR™ 254 Thermally Cross Linking Bottom Anti-Reflectant

AR™ 254 Thermally Cross Linking Bottom Anti-Reflectant

AR™ 254 is an organic, thermally cross-linking bottom anti-reflectant for 248 nm (KrF) photoresist. It has excellent gap filling and planarizing properties that are key requirements for advanced semiconductor devices having FinFET structures. AR™ 254 has a high etch rate to reduce substrate damage and optimal optical parameters to minimize reflectance.

Solutions
  • Anti-Reflectants & Functional Sublayers
 
 
 

Features & benefits

  • Excellent planarizing property to minimize thickness gap on various pattern density
  • Excellent resist CD and profile control on topography
  • Good gap fill property at extremely narrow trench
  • High etch rate to minimize etch bias and substrate damage
  • Increases process margin
  • Optimal n & k values
  • Reduces substrate damage due to high etch rate
  • Excellent planarizing property to minimize thickness gap on various pattern density
  • Excellent resist CD and profile control on topography
  • Good gap fill property at extremely narrow trench
  • High etch rate to minimize etch bias and substrate damage
  • Increases process margin
  • Optimal n & k values
  • Reduces substrate damage due to high etch rate
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    Available Sizes

    Gross Weight Net Weight Carton Each Carton Length Carton Weight Carton Height
    757 0 0 0
    757 0 0 0
    757 0 0 0
     
     
     
     
     
     
    Product Details

    Fabric/material

    ARCS

    Design

    AR254-1000 DUV

    Seam

    AR254-1000 DUV ANTI-REFLECTANT

    Packaging

    ARCS

    Hazard

    Coated Material

    ARCS

    Features

    ARCS

     
     
     
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