DuPont Electronic Solutions offers a complete family of electrolytic tin technologies to enhance reliable interconnections for connector parts.
Solderon™ BT-280 Semi-Bright to Bright Tin
Description: High-speed, pure tin plating product formulated for superior brightness and solderbility with low carbon content in the deposit and low whisker propensity.
Solderon™ BHT-350 Bright Tin
Description: High-speed, pure tin plating product customized for room temperature to elevated temperature operation.
Solderon™ ST-400 High Speed Matte Tin
Description: A single additive matte tin process with greater that a 40% increase in plating speed versus exisitng Solderon Tin products, providing deposits with very low whisker risk across the wide plating window, utilising a sustainable antioxidant.