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CIRCUBOND™ TREATMENT 2218

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CIRCUBOND™ TREATMENT 2218

Solutions
  • High Density Interconnect
 
 
 

Features & benefits

  • Easy yet complete analytical control
  • Excellent peel strength on wide variety of substrates
  • Long bath life
  • Minimal attack on copper surfaces
  • Thorough removal of oils, light oxides and resist residues
  • Uniform, water-break free surface
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    Product Details

    Fabric/material

    INNERLAYER BONDING

    Design

    CIRCUBOND TRTMT 2218A 01

    Seam

    2218A

    Packaging

    HDOW CIRCUIT TECHNOLOGIES

    Hazard

    Coated Material

    PRINTED CIRCUIT BOARDS

    Features

    INNERLAYER BONDING
     
     
     
    Technical Resources
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    Safety Data Sheets(All Languages)
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