The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.
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Fabric/material |
MAKING HOLES CONDUCTIVE |
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Design |
CPOSIT 3350 M-1 EC |
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Seam |
CIRCUPOSIT 370 M-1 |
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Packaging |
HDOW CIRCUIT TECHNOLOGIES |
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Hazard |
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Coated Material |
PRINTED CIRCUIT BOARDS |
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Features |
MAKING HOLES CONDUCTIVE |