CIRCUPOSIT™ 3350-1 ELECTROLESS COPPER

CIRCUPOSIT™ 3350-1 ELECTROLESS COPPER

The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.

Solutions
  • Multi Layered Boards
 
 
 

Features & benefits

  • Excellent bath stability and performance
  • Exceptional Interconnect Reliability
  • Horizontal or vertical application
  • Low-build or high-build deposition
  • Reduced bath maintenance
  • Reduction in solution volume growth
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    Product Details

    Fabric/material

    MAKING HOLES CONDUCTIVE

    Design

    CPOSIT 3350 M-1 EC

    Seam

    CIRCUPOSIT 370 M-1

    Packaging

    HDOW CIRCUIT TECHNOLOGIES

    Hazard

    Coated Material

    PRINTED CIRCUIT BOARDS

    Features

    MAKING HOLES CONDUCTIVE

     
     
     
    Technical Resources
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      Safety Data Sheets(All Languages)
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