Circuposit™ Hole Prep 4126 is a solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stage. This process defines a new standard for via plating. Hole Prep 4126 is formulated to process both traditional FR-4 type laminates and more advanced high Tg materials.
Excellent Smear Removal
More Dielectric Roughness Delivers Higher Adhesion