English

CIRCUPOSIT™ 4500 ELECTROLESS COPPER

CIRCUPOSIT™ 4500 ELECTROLESS COPPER

Circuposit™ 4500 Electroless Copper is a self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications.

Solutions
  • High Density Interconnect
  • IC Substrate
  • Multi Layered Boards
 
 
 

Features & benefits

  • Excellent performance on wide selection of resins
  • Great for thin boards or cores (thickness: 50µm)
  • Improved working environment with closed system
  • Suitable for both high or low build application
    		•
     
     
     
     
     
     
     
     
     
    Product Details

    Fabric/material

    MAKING HOLES CONDUCTIVE

    Design

    CIRCUPOSIT 4500A EC

    Seam

    CIRCUPOSIT 4500A APR

    Packaging

    HDOW CIRCUIT TECHNOLOGIES

    Hazard

    Coated Material

    PRINTED CIRCUIT BOARDS

    Features

    MAKING HOLES CONDUCTIVE
     
     
     
    Technical Resources
    View by:
    ✕
    ✕
    To access secured content from DuPont Please Sign In or Sign Up below
       
       
       
      Safety Data Sheets(All Languages)
      View by:
      ✕
      ✕
      To access secured content from DuPont Please Sign In or Sign Up below
         
         
         
         
         
         
        -